1. HI-SPEED Board Design Introduction
2. TRANSMISSION LINE THEORY
3. RETURN CURRENT PATH
4. Elctromagnetic Waves by Intuition
5. Main Problems/Challenges in Board & PCB Design for
6. Practical Transmission Line Impedance Missmatching & Reflections
7. Impedance matching by TERMINTION
8. Crosstalk
9. The Real world of CAPACITOR
10. Power Integrity Problems & Solutions
11. EMI INTRODUCTION
12. FARADAY CAGE & GROUNDED VIA FENCE
13. PCB LAYERS Layout Design
14. Ferrite Beads and Inductors
15. ANALOG PCB Layout- Placement & Routing Design
16. תכנון מעגלים-מודפסים – לפי התקנים IPC-2221 [המרצה מכותבי התקן]
17. DIGITAL PCB Layout – Placement & Routing Design
18. תכנון מעגלים-מודפסים – לפי התקן IPC-2251 Standards [המרצה מכותבי התקן
19. SDRAM/DDR2/DDR3/DDR4
RETURN CURRENT PATH
| WHERE IS THE LOOP |
| Hi-Speed Return current path DC VS. AC |
| CURRENT PATH of Microstrip Top Layer Rise Time: Low-to-High Transition |
| CURRENT PATH of Microstrip Top Layer Fall Time: High-to-Low Transition |
| VIA = חור-מעבר The Stitching Via |