Multigiga Lossy T-Lines -Channel Design 1-10 Gbps
1.1. Frequency domain modeling of interconnections |
1.1. Hi-Speed Problems: Skin Effect, Dielectric materials, Vias |
1.1. Dielectric Losses of isolators |
Dissipation Factor of PCB Materials FR4 VS NELCO4000 |
Copper Loss @ Trace Width |
ISI (Inter-Symbol Interference) |
Roughness -Copper Profile Specifications |
Copper Loss vs Surface Roughness |